Friday, October 19, 2012

SonicSolder | Ultrasonic Soldering | Lead-Free Soldering: S-Bond.com I Ultrasonic soldering

EWI SonicSolder utilizing ultrasonic soldering methods. Lead-Free soldering in electronics applications.




Utrasonics can be conjunction with  soldering and is used to join difficult-to-wet materials like aluminum, titanium, glass, ceramics and dissimilar materials.  Potential applications include tubing, electronics, medical products and structural components. In various base metal (copper, aluminum, titanium) combinations, shear strength of about 5 ksi have been obtained.All of S-Bond solder alloys  are compatible with and effectively used in bonding a wide range of materials.